| 摘要 |
PROBLEM TO BE SOLVED: To provide a casing heat dissipation structure with excellent heat dissipation efficiency but without the troubles of noise and the life in a switching hub including a heater such as an LSI chip therein. SOLUTION: A heater abutment section 7 is provided, recessed in an included unit casing 3 with a joggle processing or a drawing processing, and a heater 5 is brought into abutment with the heater abutment section 7 via a heat conductive rubber sheet 9. The included unit casing 3 is internally with a body apparatus casing 2. Hereby, heat produced from the heater 5 is effectively conducted to the included unit casing 3, and is dissipated to the outside of the body apparatus casing 2 with the aid of heat conduction. Since the need of any exhaust fan is eliminated, no trouble concerning noise and the life occur. COPYRIGHT: (C)2004,JPO
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