发明名称 |
SILVER-COATED COPPER POWDER AND CONDUCTIVE PASTE, CONDUCTIVE MATERIAL, AND CONDUCTIVE SHEET USING SAME |
摘要 |
Provided is a silver-coated copper powder that has a dendritic shape, that ensures excellent conductivity as a result of having an increased number of points of contact when silver-coated dendritic copper particles are in contact, that prevents aggregation, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The silver-coated copper powder comprises amassed dendritic copper particles 1 having a linearly grown main trunk 2 and a plurality of branches 3 branching from the main trunk 2. The surface of the copper particles 1 is coated with silver. The main trunk 2 and the branches 3 of the copper particles 1 have a flat plate shape in which the average cross-sectional thickness is more than 1.0 µm but no more than 5.0 µm. The silver-coated copper powder has a flat plate shape configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 µm. |
申请公布号 |
WO2016151859(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
WO2015JP59482 |
申请日期 |
2015.03.26 |
申请人 |
SUMITOMO METAL MINING CO., LTD. |
发明人 |
OKADA, Hiroshi;YAMASHITA, Hideyuki |
分类号 |
B22F1/00;B22F1/02;C09C1/62;C09C3/06;C09D5/24;C09D201/00;C23C18/42;C25C5/02;H01B1/00;H01B1/22;H01B5/00 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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