| 摘要 |
PURPOSE:To remove bubbles simply only by energizing centrifugal force, and to prevent the generation of trouble in a display by utilizing the difference of specific gravity of a resin and bubbles in the resin mold type semiconductor device. CONSTITUTION:Openings 11, 12 as display windows for a light-shielding case 4 are sealed with a tape 6, and the liquefied resin 5 is injected. The tape 6 side is set up to a turning gear while being directed to the outside under the state in which the resin is soft sufficiently, and centrifugal force is energized. Since the specific gravity of bubbles 7 is smaller than that of the resin 5, bubbles 7 float gradually in the resin, are discharged into atmospheric air from the surface on the central side of the resin and are removed. The resin is cured, the tape 6 on the display window side is torn off, and the state of luminescence can be observed through the display windows. |
