| 摘要 |
PURPOSE:To prevent a short circuit between a wire and a die pad by forming an insulating member around a chip on the chip loading surface of the die pad while connecting the chip and an inner lead by the metallic small-gage wire and sealing the whole surface with a resin. CONSTITUTION:In a die pad 1, on the chip loading surface of a top face of which a chip 2 is placed, a die-pad hanging lead 3 is arranged to the opposed side sections 1a of the die pad 1 while a large number of inner leads 4 are mounted respectively in a mutually symmetric manner centering around the extension of the die-pad hanging lead 3, and a plurality of these inner leads are connected, thus constituting a lead frame. Bonding pads 2a and the inner leads 4 are connected by bonding wires 5, and sealed by a molding resin layer 6. A frame-shaped insulating film 7 is stuck to the chip loading surface of the die pad 1 so as to surround the chip 2 at that time. Accordingly, the hanging of the wires and short circuit among the wires and the die pad are prevented while constraint on the mounting of the die pad and the chip is removed, and the diversified chips can be mounted by using the same lead frame. |
