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发明名称
SEMICONDUCTOR PACKAGE
摘要
<p>The package minimizesd wire bonding of an inner lead pad of the chip; (C) molding an encapsulating resin.</p>
申请公布号
KR940008336(B1)
申请公布日期
1994.09.12
申请号
KR19910010112
申请日期
1991.06.19
申请人
SAMSUNG ELECATRONICS CO., LTD.
发明人
KWON, YONG - DO;AN, MIN - CHOL
分类号
H01L23/48;(IPC1-7):H01L23/48
主分类号
H01L23/48
代理机构
代理人
主权项
地址
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