发明名称 METHOD OF PATTERN FORMATION AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To enable formation of an accurate pattern within an allowable error even if a warp amount of each substrate is not constant by correcting a pattern position on a mask, considering an allowable limit value for warp of a substrate. CONSTITUTION:When a warp equivalent to an allowable maximum value is generated in a substrate 10, an interval between rear edges T2, E2 is made equal to a margin Y. As for a warp of an allowable maximum value or less, an interval between rear edges T2, E2 is necessarily made larger than a margin Y. Meanwhile, the smaller a warp of the substrate 10 is, the narrower an interval between front edges T1, E1 is. Therefore, when a warp equivalent to an estimated minimum value is generated in the substrate 10, an interval between front edges T1, E1 is made coincide with a margin X and it is possible to effectively prevent a front edge E1 of an electrode 5a from protruding over a front edge T1 an n-emitter region 14a to a warp of an estimated minimum value or less.</p>
申请公布号 JPH03257871(A) 申请公布日期 1991.11.18
申请号 JP19900056834 申请日期 1990.03.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 NIINOBU HIROHARU;TOKUNO FUTOSHI
分类号 H01L29/74;H01L21/332;H01L21/60;H01L21/66 主分类号 H01L29/74
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