| 摘要 |
In this component mounting machine (10), the center position of four pick-up nozzles (41) is measured with jigs (45), so the offset between the center position of the four pick-up nozzles (41) and the center position of four pin members (93) can be determined precisely. In particular, the nozzle tips of the pick-up nozzles (41) descend following the contour of the concave portions (45a) of the jigs (45), so the nozzle centers and the jig centers can be made to match precisely. In addition, pick up operation starts when the nozzle tips of the pick-up nozzles (41) reach the bottoms (45b) of the concave portions (45a) of the jigs (45), so the jig centers after the pick-up nozzles (41) are separated from the jigs (45) will match the nozzle centers. As a result, the nozzle offset between the center position of the four pick-up nozzles (41) and the center position of a substrate recognition camera (39) can be calculated precisely from an acquired image of the jigs (45). Therefore, components (P) cut from a wafer can be picked up precisely with the pick-up nozzles (41), and the precision of mounting the components (P) cut from the wafer on a substrate (B) can be improved. |
