发明名称 HYBRID THREE-DIMENSIONAL INTEGRATED CIRCUIT RECONFIGURABLE THERMAL AWARE AND DYNAMIC POWER GATING INTERCONNECT ARCHITECTURE
摘要 Systems, methods, and apparatus for operating an integrated circuit (IC) are provided. An apparatus may be configured to receive at one or more switches a signal from at least one circuit positioned on a first die lying within a first geometric plane, detect a signaling path between the at least one circuit positioned on the first die and at least one circuit positioned on a second die lying within a second geometric plane that is different from the first geometric plane, and control the one or more switches to route the signal along the signaling path. Circuits having a similar power characteristic are positioned adjacent to each other on the first die or the second die and circuits having a high temperature characteristic are positioned separate from each other on the first die or the second die.
申请公布号 US2017125383(A1) 申请公布日期 2017.05.04
申请号 US201615336576 申请日期 2016.10.27
申请人 QUALCOMM Incorporated 发明人 Liu Chunchen
分类号 H01L25/065;H03K17/14 主分类号 H01L25/065
代理机构 代理人
主权项 1. A method of operating an integrated circuit (IC), comprising: controlling one or more switches to route a signal along a signaling path between a first die lying within a first geometric plane and a second die lying within a second geometric plane different from the first geometric plane, wherein the signal is coupled to a plurality of circuits on the first die, and wherein the plurality of circuits comprises circuits having a similar power characteristic positioned adjacent to each other; and routing the signal along the signaling path.
地址 San Diego CA US