发明名称 |
HYBRID THREE-DIMENSIONAL INTEGRATED CIRCUIT RECONFIGURABLE THERMAL AWARE AND DYNAMIC POWER GATING INTERCONNECT ARCHITECTURE |
摘要 |
Systems, methods, and apparatus for operating an integrated circuit (IC) are provided. An apparatus may be configured to receive at one or more switches a signal from at least one circuit positioned on a first die lying within a first geometric plane, detect a signaling path between the at least one circuit positioned on the first die and at least one circuit positioned on a second die lying within a second geometric plane that is different from the first geometric plane, and control the one or more switches to route the signal along the signaling path. Circuits having a similar power characteristic are positioned adjacent to each other on the first die or the second die and circuits having a high temperature characteristic are positioned separate from each other on the first die or the second die. |
申请公布号 |
US2017125383(A1) |
申请公布日期 |
2017.05.04 |
申请号 |
US201615336576 |
申请日期 |
2016.10.27 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Liu Chunchen |
分类号 |
H01L25/065;H03K17/14 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
1. A method of operating an integrated circuit (IC), comprising:
controlling one or more switches to route a signal along a signaling path between a first die lying within a first geometric plane and a second die lying within a second geometric plane different from the first geometric plane, wherein the signal is coupled to a plurality of circuits on the first die, and wherein the plurality of circuits comprises circuits having a similar power characteristic positioned adjacent to each other; and routing the signal along the signaling path. |
地址 |
San Diego CA US |