| 摘要 |
Provided is a substrate for mounting a semiconductor element, said substrate having improved adhesion between an electrode layer and a resin due to said electrode layer having roughened side surfaces and a cross-section shaped substantially like an inverted trapezoid. Also provided is a method for manufacturing said substrate, said method being characterized by containing the following steps, in this order: a) a step in which a two-layer resist layer comprising a bottom resist layer and a top resist layer is formed, from resists having different main photosensitivity wavelengths, on the surface of a metal plate; b) a step in which, with the bottom resist layer unexposed, the top resist layer is exposed using a prescribed pattern; c) a developing step in which a prescribed pattern of openings is formed in the top resist layer and the same prescribed pattern of openings is formed in the unexposed bottom resist layer, thereby partially revealing the surface of the metal plate; d) a step in which the bottom resist layer is exposed and cured; e) a step in which a prescribed plating layer is formed on the parts of the metal-plate surface revealed by the bottom resist layer; f) a step in which the entire two-layer resist layer, i.e. the bottom resist layer and the top resist layer, is removed; and g) a step in which the side surfaces of the plating layer formed in step e) are roughened. |
