PROCESS OF FABRICATING PRINTED CIRCUIT BOARD

摘要

A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

主权项

1. A process of fabricating a printed circuit board comprising:
attaching a conductive sheet to a first insulator, the conductive sheet comprising an irregular surface opposed to the first insulator; forming a mask upon a protected portion of the irregular surface; planarizing an unprotected portion of the irregular surface uncovered by the mask, and; subsequent to planarizing the unprotected portion, patterning the conductive sheet into at least one circuit feature, the patterned conductive sheet comprising a maintained irregular surface and a planarized surface.