WAFER INSPECTION METHOD AND WAFER INSPECTION APPARATUS

摘要

Provided is a wafer inspection method whereby whether there is a pit in a wafer surface can be inspected. This wafer inspection method is characterized by including: a step for picking up defects of a wafer 1 using a first optical system 10; a step for selecting pit candidates from among thus picked up defects; and a step for classifying the pit candidates into a group of pit defects and a group of defects other than the pit defects using a second optical system 20.