| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a non-contact communication medium such that an IC inlay can be produced at low cost, and a method of connecting an antenna and a circuit device.SOLUTION: There is provided a method of manufacturing a non-contact communication medium 100 which has one or more circuit devices 50 electrically connected to antenna wiring 15 formed by winding a wire with ends which includes a metal wire in a predetermined antenna pattern. The method includes the processes of: preparing a support substrate 10 which has a pair of wire ends at both ends of the antenna wiring 15 terminated on a through hole OP10, the support substrate 10 being provided with the antenna wiring 15 on at least one of a pair of main surface of the support substrate 10 and also provided with the at least one through hole OP10 penetrating between the main surfaces of the support substrate 10; arranging a circuit device 50 having at least one pair of connection terminal parts at least partially in the through hole OP10; and individually and electrically connecting the one pair of wire ends of the antenna wiring 15 and one pair of connection terminal parts of the circuit device 50. |
