Embedded venting system

摘要

The embodiments relate to integrating a venting system in a circuit board. Three or more interconnected accesses (VIAs) are formed in a printed circuit board (PCB). The VIAs are interconnected by routing a bi-planar channel spanning through the VIAs. The channel includes at least two sections, including a first channel section at a first plane extending from the first VIA to the second VIA and a second channel section at a second plane extending from the second VIA to the third VIA. The first and second sections are at different planar levels.

主权项

1. A system comprising:
a printed circuit board (PCB) comprising a first area and a second area, and at least three interconnected accesses (VIAs) bounded by oppositely disposed sides of the PCB, wherein the VIAs are positioned with respect to the first and second areas; and a venting system integrated within the PCB, the venting system comprising:
an interconnection of the at least three VIAs; anda channel spanning through the VIAs, the channel comprising at least two sections, including a first section extending from the first VIA to the second VIA and a second section extending from the second VIA to the third VIA, wherein at least one of the first and second sections are positioned within the oppositely disposed sides of the PCB.