发明名称 |
CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME |
摘要 |
A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance. |
申请公布号 |
US2017040091(A1) |
申请公布日期 |
2017.02.09 |
申请号 |
US201515303731 |
申请日期 |
2015.03.30 |
申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
NAKAYAMA SHOGO |
分类号 |
H01C1/032;H01C7/00;H01C1/148;H01C17/00 |
主分类号 |
H01C1/032 |
代理机构 |
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代理人 |
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主权项 |
1. A chip resistor comprising:
an insulating substrate having an upper surface and edge surfaces; a resistive element provided on the upper surface of the insulating substrate; a pair of upper-surface electrodes provided on respective ones of both end portions of the upper surface of the resistive element so as to expose a part of an upper surface of the resistive element from the upper-surface electrodes; and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes, wherein the pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively, and wherein each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. |
地址 |
Osaka JP |