发明名称 CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME
摘要 A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.
申请公布号 US2017040091(A1) 申请公布日期 2017.02.09
申请号 US201515303731 申请日期 2015.03.30
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 NAKAYAMA SHOGO
分类号 H01C1/032;H01C7/00;H01C1/148;H01C17/00 主分类号 H01C1/032
代理机构 代理人
主权项 1. A chip resistor comprising: an insulating substrate having an upper surface and edge surfaces; a resistive element provided on the upper surface of the insulating substrate; a pair of upper-surface electrodes provided on respective ones of both end portions of the upper surface of the resistive element so as to expose a part of an upper surface of the resistive element from the upper-surface electrodes; and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes, wherein the pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively, and wherein each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate.
地址 Osaka JP