Light emitting device and lighting system having the same

摘要

Disclosed are a light emitting device. The light emitting device includes a body having a cavity; a plurality of lead frames in the cavity; a light emitting chip; a first molding member having a first metal oxide material around the light emitting chip; and a second molding member having a second metal oxide material on the first molding member and the light emitting chip, wherein the light emitting chip includes a reflective electrode layer under a light emitting structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting chip and a lateral side of the reflective electrode layer at a predetermined curvature, and wherein a bottom surface of the second molding member includes a curved surface which is convex toward the first molding member.

主权项

1. A light emitting device comprising:
a body having a cavity; a plurality of lead frames in the cavity; a light emitting chip on at least one of the lead frames; a first molding member around the light emitting chip, in which a first metal oxide material is added to the first molding member; and a second molding member on the first molding member and the light emitting chip, in which a second metal oxide material is added to the second molding member, wherein the light emitting chip comprises:
a light emitting structure including a plurality of compound semiconductor layers; anda reflective electrode layer under the light emitting structure,wherein a top surface of the first molding member extends from a region between a top surface of the light emitting chip and a lateral side of the reflective electrode layer at a predetermined curvature,wherein a bottom surface of the second molding member corresponding to the top surface of the first molding member includes a curved surface which is convex toward the first molding member,wherein a lowest point of the top surface of the first molding member is disposed lower than a top surface of the light emitting chip, andwherein a portion of the top surface of the first molding member is disposed over the reflective electrode layer.