发明名称 Field effect transistor device spacers
摘要 A method for fabricating a field effect transistor device comprises forming a fin on a substrate, forming a first dummy gate stack and a second dummy gate stack over the fin, forming spacers adjacent to the fin, the first dummy gate stack, and the second dummy gate stack, etching to remove portions of the fin and form a first cavity partially defined by the spacers, depositing an insulator material in the first cavity, patterning a mask over the first dummy gate stack and portions of the fin, etching to remove exposed portions of the insulator material, and epitaxially growing a first semiconductor material on exposed portions of the fin.
申请公布号 US9536981(B1) 申请公布日期 2017.01.03
申请号 US201514868414 申请日期 2015.09.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;GLOBALFOUNDRIES INC. 发明人 Cai Xiuyu;Mehta Sanjay C.;Yamashita Tenko
分类号 H01L29/66;H01L21/8238;H01L27/092 主分类号 H01L29/66
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP ;Alexanian Vazken
主权项 1. A method for fabricating a field effect transistor device, the method comprising: forming a fin on a substrate; forming a first dummy gate stack and a second dummy gate stack over the fin; forming spacers adjacent to the fin, the first dummy gate stack, and the second dummy gate stack; etching to remove portions of the fin and form a first cavity partially defined by the spacers; depositing an insulator material in the first cavity; patterning a mask over the first dummy gate stack and portions of the fin; etching to remove exposed portions of the insulator material; epitaxially growing a first semiconductor material on exposed portions of the fin; removing the mask; depositing a layer of insulator material on the fin, the first dummy gate stack and the second dummy gate stack; patterning a mask over the second dummy gate stack and portions of the fin; etching to remove exposed portions of the insulator material and the layer of insulator material to form a second cavity partially defined by the spacers; and epitaxially growing a second semiconductor material on exposed portions of the fin.
地址 Armonk NY US