发明名称 Sb−Te基合金焼結体スパッタリングターゲット
摘要 Sb-Te-based alloy sintered sputtering target having a Sb content of 10 to 60 at%, a Te content of 20 to 60 at%, and remainder being one or more types of elements selected from Ag, In, and Ge and unavoidable impurities, wherein an average grain size of oxides is 0.5 µm or less. An object of this invention is to improve the texture of the Sb-Te-based alloy sintered sputtering target in order to prevent the generation of arcing during sputtering and improve the thermal stability of the sputtered film.
申请公布号 JP6037421(B2) 申请公布日期 2016.12.07
申请号 JP20160510132 申请日期 2015.02.20
申请人 JX金属株式会社 发明人 小井土 由将
分类号 C23C14/34;B22F3/14;C22C1/04;C22C12/00;C22C28/00;C22C32/00 主分类号 C23C14/34
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