发明名称 発光装置、照明器具、および発光装置の製造方法
摘要 PROBLEM TO BE SOLVED: To prevent a sealing resin body from being collapsed to achieve high-density arrangement of a plurality of light emitting elements.SOLUTION: A part of each LED chip 80 of two LED arrays 60 sandwiching a boundary part between adjacent two compartment regions is arranged on a liquid repellent part 20 at the boundary part, and the width L1 of the liquid repellent part 20 satisfies an expression (L1≥(L2-P+2&Dgr;x+0.15); where L2 represents a width of each LED chip, P represents an array pitch of a plurality of the LED arrays, and &Dgr;x represents a position shift amount of each LED chip).
申请公布号 JP6006033(B2) 申请公布日期 2016.10.12
申请号 JP20120177582 申请日期 2012.08.09
申请人 シャープ株式会社 发明人 児玉 正明;若村 紗友里;坂本 泰宏
分类号 H01L33/54;F21S2/00 主分类号 H01L33/54
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