发明名称 パワー半導体モジュールおよびその組立方法
摘要 PROBLEM TO BE SOLVED: To provide a power semiconductor module that can prevent an SiC freewheeling diode from breaking down when a surge voltage or a dynamic avalanche voltage of an Si switching element is applied to the SiC freewheeling diode.SOLUTION: The power semiconductor module includes an SiC-SBD 2 having a static avalanche voltage Vavs2 higher than a static avalanche voltage Vavs1 of an Si-IGBT 1 in a whole range of junction temperature used. According to the configuration, even when a surge voltage or a dynamic avalanche voltage Vavd of the Si-IGBT 1 is applied to the SiC-SBD 2, the static avalanche voltage Vavs2 of the SiC-SBD 2 is higher than the voltage applied to prevent the SiC-SBD 2 from breaking down in the whole range of junction temperature used.
申请公布号 JP6007578(B2) 申请公布日期 2016.10.12
申请号 JP20120108483 申请日期 2012.05.10
申请人 富士電機株式会社 发明人 中沢 将剛;岩本 進
分类号 H02M7/48;H01L25/07;H01L25/18 主分类号 H02M7/48
代理机构 代理人
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