| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method of a work and a cutting device of the work capable of remarkably improving the whole shape of waviness and warp or the like of wafer which is cut out.SOLUTION: In a cutting method of a work, a wire array formed with a wire helically wound between a plurality of wire guides is travelled in the shaft direction, processing liquid is supplied to a contact part between a cylindrical work and the wire, at the same time, the work is pushed against the wire array to perform radial feed and the work is cut in a wafer shape. Therein, the wire prepared by covering the surface of base wire with organic coating film or inorganic coating film is used, a roughening member for roughening the wire surface is arranged on the wire playing-out side of the wire array from the work to be cut, the wire is brought into contact with the roughening member, thereby, the work is cut while roughening the wire surface. |
