| 摘要 |
To provide a high-reliable transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed, the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad. |
