| 摘要 |
Provided is a composition that is highly workable, fast-curing, highly thermally conductive, and low-outgassing. A thermally conductive composition containing: (A) an insulating thermally conductive filler; (B) a polyalkylene glycol having a hydrolysable silyl group; (C) an organotitanium-based curing catalyst; and (D) a silane coupling agent; the (A) component containing: (A-1) a filler component having a mean particle diameter of 0.1 mum to less than 2 mum; (A-2) a filler component having a mean particle diameter of 2 mum to less than 20 mum; and (A-3) a filler component having a mean particle diameter of 20 mum to 100 mum. Preferably, the (B) component is (B-1) a polyalkylene glycol having a hydrolysable silyl group at both ends of a molecular chain or (B-2) a polyalkylene glycol having a hydrolysable silyl group at one end of a molecular chain. This composition can be used as a heat dissipation material, an adhesive agent, or a coating agent. |
