| 发明名称 |
SEMICONDUCTOR DEVICE HAVING NETWORK-ON-CHIP STRUCTURE AND ROUTING METHOD THEREOF |
| 摘要 |
A semiconductor device includes a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias) a plurality of semiconductor elements formed in each of the semiconductor chips, a plurality of nodes suitable for coupling the semiconductor elements to one another, and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements. |
| 申请公布号 |
US2016147463(A1) |
申请公布日期 |
2016.05.26 |
| 申请号 |
US201514667255 |
申请日期 |
2015.03.24 |
| 申请人 |
SK hynix Inc. ;RESERCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY |
发明人 |
HAN Tae Hee;HWANG Jun Sun |
| 分类号 |
G06F3/06;G06F15/78;H01L23/34;H01L27/02;H01L23/48;H01L25/065 |
主分类号 |
G06F3/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias); a plurality of semiconductor elements formed in each of the semiconductor chips; a plurality of nodes suitable for coupling the semiconductor elements to one another; and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements. |
| 地址 |
Gyeonggi-do KR |
