发明名称 |
Heating phase change material |
摘要 |
A phase change memory may be formed of two vertically spaced layers of phase change material. An intervening dielectric may space the layers from one another along a substantial portion of their lateral extent. An opening may be provided in the intervening dielectric to allow the phase change layers to approach one another more closely. As a result, current density may be increased at this location, producing heating. |
申请公布号 |
US9343676(B2) |
申请公布日期 |
2016.05.17 |
申请号 |
US201414167122 |
申请日期 |
2014.01.29 |
申请人 |
Micron Technology, Inc. |
发明人 |
Wicker Guy C.;Pellizzer Fabio;Varesi Enrico;Pirovano Agostino |
分类号 |
H01L45/00;G11C13/00;H01L27/24 |
主分类号 |
H01L45/00 |
代理机构 |
Dorsey & Whitney LLP |
代理人 |
Dorsey & Whitney LLP |
主权项 |
1. A method comprising:
spacing a pair of chalcogenide layers by first and second intervening layers, wherein said first and second intervening layers are disposed between a top surface of a first chalcogenide layer of said pair of chalcogenide layers and a bottom surface of a second chalcogenide layer of said pair of chalcogenide layers, wherein the second intervening layer is silicon nitride; and forming an opening through said first intervening layer to reduce spacing between said pair of chalcogenide layers. |
地址 |
Boise ID US |