发明名称 Heating phase change material
摘要 A phase change memory may be formed of two vertically spaced layers of phase change material. An intervening dielectric may space the layers from one another along a substantial portion of their lateral extent. An opening may be provided in the intervening dielectric to allow the phase change layers to approach one another more closely. As a result, current density may be increased at this location, producing heating.
申请公布号 US9343676(B2) 申请公布日期 2016.05.17
申请号 US201414167122 申请日期 2014.01.29
申请人 Micron Technology, Inc. 发明人 Wicker Guy C.;Pellizzer Fabio;Varesi Enrico;Pirovano Agostino
分类号 H01L45/00;G11C13/00;H01L27/24 主分类号 H01L45/00
代理机构 Dorsey & Whitney LLP 代理人 Dorsey & Whitney LLP
主权项 1. A method comprising: spacing a pair of chalcogenide layers by first and second intervening layers, wherein said first and second intervening layers are disposed between a top surface of a first chalcogenide layer of said pair of chalcogenide layers and a bottom surface of a second chalcogenide layer of said pair of chalcogenide layers, wherein the second intervening layer is silicon nitride; and forming an opening through said first intervening layer to reduce spacing between said pair of chalcogenide layers.
地址 Boise ID US