MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION

摘要

The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer.