| 发明名称 |
LASER FIBER ARRAY FOR SINGULATING SEMICONDUCTOR WAFERS |
| 摘要 |
An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate. |
| 申请公布号 |
US2016121426(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201414533204 |
申请日期 |
2014.11.05 |
| 申请人 |
HOLLINGER Franz;VAN DER STAM Karel Maykel Richard;VERHAART Dick;KNIPPELS Guido Martinus Henricus |
发明人 |
HOLLINGER Franz;VAN DER STAM Karel Maykel Richard;VERHAART Dick;KNIPPELS Guido Martinus Henricus |
| 分类号 |
B23K26/06;B23K26/067;H01L21/67 |
主分类号 |
B23K26/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for cutting a substrate, the apparatus comprising:
first and second lasers: and first and second optical fibers, each having an input end and an output end opposite to the input end, the input ends of the first and second optical fibers being connected to the first and second lasers respectively; wherein the output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate. |
| 地址 |
Oberreidenbach DE |
