SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM

摘要

The present invention is to prevent pattern collapse on a wafer (W) in supercritical processing. A substrate processing method comprises the processes of: supplying rinse solution, IPA, first fluorine-contained organic solvent, and second fluorine-contained organic solvent to the wafer (W) in an outer chamber of a liquid processing unit (2); transporting the wafer (W) a processing container (3A) of a supercritical unit (3); and supplying fluorine-contained organic solvent for supercritical processing as high-pressure fluid in a supercritical state to the wafer (W) in the processing container (3A). Low-humidity N_2 gas is supplied into an outer chamber (21) at the time of supplying at least IPA, and the inside of the outer chamber (21) is made into a low-humidity N_2 gas atmosphere to prevent moisture absorption by the IPA.