| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card preheating method that can preheat a probe card in a short period of time when electrical characteristics of a wafer are to be checked with a wafer checkup device.SOLUTION: A probe card preheating method uses an alignment chamber 13 and a checkup chamber 17, and the checkup chamber 17 has a probe card 18, a sealing member 21 surrounding a plurality of probes 18A, a temperature-controllable lifting body 22 for lifting a wafer W, and an exhaust mechanism 24 for a sealed space among the wafer W, the sealing member 21 and the probe card 18. The method comprises a step of lifting the wafer W via the lifting body 22 to bring the wafer W into contact with the sealing member 21 when checking electrical characteristics of the wafer W, a step of reducing the pressure within the sealed space via the exhaust mechanism 24 and causing the wafer W to be adsorbed by the sealing member 21 and a step of preheating with the lifting body 22 the probe card 18 in contact with the wafer W.SELECTED DRAWING: Figure 5 |
