| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has adequate copper foil adhesiveness, glass transition temperature, moisture solder heat resistance, low thermal expansion, flame retardance and dielectric characteristics; and a prepreg; a laminate; and a printed wiring board.SOLUTION: A thermosetting resin composition contains: a compound which is obtained by reacting a maleimide compound having at least two N-substituted maleimide groups in one molecule and an amine compound that is represented by formula (a2-1) and has an acidic substituent, and has the acidic substituent and the N-substituted maleimide group in a molecular structure; and a compound which is obtained by reacting a siloxane resin having a carboxyl group in a molecule terminal and an epoxy compound having at least two epoxy groups in one molecule, and has a hydroxyl group and the epoxy group in a molecular structure. In the formula (a2-1), Ris an acidic substituent of a hydroxyl group, a carboxyl group or a sulfonic acid group; Ris an alkyl group or a halogen atom; x is an integer of 1 to 5; and y is an integer of 0 to 4.SELECTED DRAWING: None |
