HEAT PIPE ASSEMBLY WITH BONDED FINS ON THE BASEPLATE HYBRID

摘要

A hybrid heat pipe assembly includes a baseplate dimensioned to be placed in surface contact with a device. The baseplate is configured to extract heat from the device. A plurality of fins is bonded to the baseplate. The fins are configured to transfer a first portion of the extracted heat from the baseplate to air surrounding the fins. A complex heat pipe extends from the baseplate and has an end positioned within the baseplate. The complex heat pipe is configured to receive and transfer a second portion of the extracted heat transferred from the baseplate. The complex heat pipe is configured to transfer the second portion of heat to a heat pipe fin stack to which.

主权项

1. A hybrid heat pipe assembly comprising:
a baseplate dimensioned to be placed in surface contact with a device, the baseplate being configured to extract heat from the device; a plurality of fins bonded to the baseplate, the fins being configured to transfer a first portion of the extracted heat from the baseplate to air surrounding the fins; a complex heat pipe extending from the baseplate and having an end positioned within the baseplate, the complex heat pipe being configured to receive and transfer a second portion of the extracted heat transferred from the baseplate; and a heat pipe fin stack to which the complex heat pipe is configured to transfer the second portion of heat, the heat pipe fin stack being joined to the complex heat pipe and configured to transfer the second portion of the extracted heat received from the complex heat pipe to air surrounding the stack.