OPTICALLY PUMPED SENSORS OR REFERENCES WITH DIE-TO-PACKAGE CAVITIES

摘要

An optoelectronic packaged device includes stacked components within a package including a package substrate providing side and a bottom wall. The stacked components includes a comb structure on the bottom wall formed from a material having a thermal resistance >a substrate material for the bottom die providing spaced apart teeth separated by gaps. The bottom die has a top surface including electrical trace(s) and a light source die for emitting light coupled to the electrical trace and a bottom surface on the comb structure. A first cavity die is on the top surface of the bottom die or on legs of the package which extend above the bottom wall. An optics die is on the first cavity die, a second cavity die is on a sealing die which is on the optics die, and a photodetector (PD) die is optically coupled to receive light from the light source die.

主权项

1. A stacked optoelectronic packaged device (packaged device), comprising:
a plurality of stacked components within a package comprising a package substrate providing side walls and a bottom wall for said package, and a lid for sealing a top of said package, said plurality of stacked components including:
a comb structure on said bottom wall comprising a material having a thermal resistance above that of a substrate material for a bottom die comprising a plurality of spaced apart teeth separated by gaps;said bottom die having a top surface including thereon at least one electrical trace and a light source die for emitting light coupled to said electrical trace and a bottom surface on said comb structure;a first cavity die on said top surface of said bottom die or on legs of said package which extend above said bottom wall;an optics die on said first cavity die;a sealing die on said optics die;a second cavity die on said sealing die, anda photodetector (PD) die optically coupled to receive said light originating from said light source die.