| 摘要 |
PROBLEM TO BE SOLVED: To provide a slurry supply device capable of preventing contamination of slurry and a polishing apparatus including the slurry supply device.SOLUTION: A slurry supply device 100A includes: a nozzle 110 configured to eject slurry S; a slurry supply unit 120 configured to receive the slurry S from the nozzle 110 and to discharge the slurry through at least one slurry hole 120-3; a receiving unit 130A configured to allow the slurry supply unit 120 to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry S from the slurry supply unit 120, the receiving unit 130A configured to receive a flowing material 200 around the slurry supply unit 120; and a slurry protection unit configured to enclose a space for passage of the slurry S from an exit of the nozzle 110 to an entrance of the slurry supply unit 120 with the flowing material 200, the slurry protection unit including a nozzle receiving groove and a main cover 141A.SELECTED DRAWING: Figure 3B |
