| 摘要 |
An embodiment relates to a light emitting device with reduced surface roughness, a method of manufacturing the light emitting device, a light emitting device package, and a lighting system. The light emitting device according to the embodiment includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer arranged under the first conductivity type semiconductor layer, an active layer arranged between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, holes which penetrate from the lower surface of the second conductivity type semiconductor layer to the second conductivity type semiconductor layer and the active layer and exposes part of the first conductivity type semiconductor layer, and a first contact electrode which is electrically connected to the first conductivity semiconductor layer from the lower surface of the second conductivity semiconductor layer through the holes. The first contact electrode includes a capping layer on the first electrode layer, a conduction layer on the capping layer, and a contact layer on the conduction layer. |
