| 摘要 |
The present invention relates to a method for protecting a micropattern and depositing a metal layer using backside illumination technology, which allows a photoresist metal layer to be deposited on a transparent substrate and a metal layer in a state where a predetermined pattern is formed thereon while protecting a pattern that has already been formed, without alignment error and without using an optical device mask for an additional process, and which also allows post processing to be performed so as to match an existing pattern hole when performing additional etching for the pattern that has already been processed on the transparent substrate, thereby enabling precise post processing. The present invention as described above is characterized by comprising: an etching step of etching a metal layer and a transparent substrate using a photoresist comprising a predetermined pattern with respect to the metal layer formed on the transparent substrate to thereby form a pattern hole on the metal layer and the transparent substrate, or forming a pattern hole on the metal layer by etching the metal layer; a backside illumination preparation step of applying a photosensitive material onto the metal layer and the pattern hole with the predetermined pattern being formed therein by etching; and a backside illumination step of eliminating a part of the photosensitive material by backside illumination at the transparent substrate side, wherein the photosensitive material is formed of a positive photoresist, and the photosensitive material is eliminated from the predetermined pattern hole through the backside illumination step. The backside illumination step is followed by an additional etching step of etching the transparent substrate in the predetermined pattern hole from which the photosensitive material has been eliminated. |
