发明名称 Display with vias for concealed printed circuit and component attachment
摘要 An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.
申请公布号 US9286826(B2) 申请公布日期 2016.03.15
申请号 US201113284096 申请日期 2011.10.28
申请人 Apple Inc. 发明人 Wright Derek;Rothkopf Fletcher R.;Myers Scott A.
分类号 H05K5/00;G09G3/32;H01L51/52;H01L27/32 主分类号 H05K5/00
代理机构 Treyz Law Group 代理人 Treyz Law Group ;Treyz G. Victor;Woodruff Kendall P.
主权项 1. An electronic device comprising: a display having an array of display pixels formed on a polymer substrate layer with vias, wherein the polymer substrate layer extends under the entire array of display pixels, wherein the array of display pixels includes first and second adjacent display pixels, and wherein one of the vias is located between the first and second adjacent display pixels; electroplated metal sidewalls in the vias; a printed circuit substrate coupled to the polymer substrate layer; and display driver circuitry mounted to the printed circuit substrate, wherein the printed circuit substrate includes conductive traces electrically coupled between at least one of the vias and the display driver circuitry.
地址 Cupertino CA US