发明名称 Self-heating integrated circuit
摘要 Self-heating integrated circuits are provided. In one embodiment, a self-heating integrated circuit comprises a drive circuit configured to drive a device and a controller configured to selectively operate the drive circuit in a first mode or a second mode. In the first mode, the controller is configured to operate the drive circuit to drive the device and, in the second mode, the controller is configured to operate the drive circuit to heat the integrated circuit to a target temperature.
申请公布号 US9275927(B1) 申请公布日期 2016.03.01
申请号 US201213719883 申请日期 2012.12.19
申请人 Western Digital Technologies, Inc. 发明人 Ferris Timothy A.;Agness John R.
分类号 G01R31/304;H01L23/34;G01R31/26 主分类号 G01R31/304
代理机构 代理人
主权项 1. A method for heating an integrated circuit (IC) including a first drive circuit configured to drive a spindle motor and a second drive circuit configured to drive a voice coil motor (VCM) coil, the method comprising: selectively operating the first drive circuit to drive the spindle motor; selectively operating the second drive circuit to drive the VCM coil; and selectively operating the first and second drive circuits to heat the IC to a target temperature.
地址 Irvine CA US