发明名称 |
REVERSED STACK MTJ |
摘要 |
An integrated circuit device includes a substrate and a magnetic tunneling junction (MTJ). The MTJ includes at least a pinned layer, a barrier layer, and a free layer. The MTJ is formed over a surface of the substrate. Of the pinned layer, the barrier layer, and the free layer, the free layer is formed first and is closest to the surface. This enables a spacer to be formed over a perimeter region of the free layer prior to etching the free layer. Any damage to the free layer that results from etching or other free layer edge-defining process is kept at a distance from the tunneling junction by the spacer. |
申请公布号 |
US2016043306(A1) |
申请公布日期 |
2016.02.11 |
申请号 |
US201514918671 |
申请日期 |
2015.10.21 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Huang Wei-Hang;Sung Fu-Ting;Hsu Chern-Yow;Liu Shih-Chang;Tsai Chia-Shiung |
分类号 |
H01L43/08;H01L43/02;H01L43/12 |
主分类号 |
H01L43/08 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing an integrated circuit device, comprising:
providing a substrate; and forming a free magnetic tunnel junction (MTJ) layer configured to switch between at least two different magnetic orientations over the substrate; forming an insulating MTJ barrier layer arranged over the free MTJ layer; and forming a pinned MTJ layer having a fixed magnetic orientation over the insulating MTJ barrier layer; wherein the insulating MTJ barrier layer and the pinned MTJ layer have substantially aligned sidewalls which are disposed on an upper surface of the free MTJ layer. |
地址 |
Hsin-Chu TW |