| 摘要 |
PURPOSE: A laser processing device and a laser processing method are provided to prevent a short by removing a thin film without causing damage to an insulating layer. CONSTITUTION: A thin film of a light furnace is removed by a pulse laser in order to leave a part of the thin film in a thickness direction. The light furnace corrects the defect of a line. The pulse laser removes an insulating layer (72). The insulating layer is formed between the thin film and the line. A continuous wave (CW) laser removes the part of the thin film. |
