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发明名称
銅箔層を有する基板及びその製造方法
摘要
申请公布号
JP5851552(B2)
申请公布日期
2016.02.03
申请号
JP20140101462
申请日期
2014.05.15
申请人
ワイエムティー カンパニー リミテッド
发明人
ジョン、ソン ウク
分类号
B32B15/08;H05K3/18
主分类号
B32B15/08
代理机构
代理人
主权项
地址
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