发明名称 |
Production method of workpiece and workpiece with three-dimensional pattern |
摘要 |
A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided. |
申请公布号 |
US9242505(B2) |
申请公布日期 |
2016.01.26 |
申请号 |
US201113304399 |
申请日期 |
2011.11.24 |
申请人 |
COMPAL ELECTRONICS, INC. |
发明人 |
Chuang Wan-Li;Chang Chien-Min;Chiu Ju-Chen;Liu Chih-Hua;Chuang Tsung-Sheng |
分类号 |
B05D5/10;B44C1/20;B32B38/06;B44C5/04;B32B38/00;B32B38/16 |
主分类号 |
B05D5/10 |
代理机构 |
Jianq Chyun IP Office |
代理人 |
Jianq Chyun IP Office |
主权项 |
1. A production method of a workpiece, the production method comprising:
applying an adhesive layer on a workpiece, wherein a material of the adhesive layer comprises thermosetting resin and radiationcurable resin; impressing the adhesive layer by using a mold, so that the adhesive layer forms a three-dimensional pattern; performing a first curing process on the adhesive layer by one of radiation-curing and thermal-curing; punching the workpiece after performing the first curing process on the adhesive layer, so that the workpiece forms a three-dimensional workpiece; and performing a second curing process on the adhesive layer by another one of radiation-curing and thermal-curing after punching the workpiece. |
地址 |
Taipei TW |