发明名称 Production method of workpiece and workpiece with three-dimensional pattern
摘要 A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
申请公布号 US9242505(B2) 申请公布日期 2016.01.26
申请号 US201113304399 申请日期 2011.11.24
申请人 COMPAL ELECTRONICS, INC. 发明人 Chuang Wan-Li;Chang Chien-Min;Chiu Ju-Chen;Liu Chih-Hua;Chuang Tsung-Sheng
分类号 B05D5/10;B44C1/20;B32B38/06;B44C5/04;B32B38/00;B32B38/16 主分类号 B05D5/10
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A production method of a workpiece, the production method comprising: applying an adhesive layer on a workpiece, wherein a material of the adhesive layer comprises thermosetting resin and radiationcurable resin; impressing the adhesive layer by using a mold, so that the adhesive layer forms a three-dimensional pattern; performing a first curing process on the adhesive layer by one of radiation-curing and thermal-curing; punching the workpiece after performing the first curing process on the adhesive layer, so that the workpiece forms a three-dimensional workpiece; and performing a second curing process on the adhesive layer by another one of radiation-curing and thermal-curing after punching the workpiece.
地址 Taipei TW