| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and method for forming bonded substrates.SOLUTION: An apparatus for bonding two substrates 152, 172 includes a first roller 104; a second roller 108 that forms a nip with the first roller 104; a substrate transport 100 configured to move the first substrate 152 and the second substrate 172 through the nip simultaneously; and a controller 50. The controller 50 operates the substrate transport 100 to move the first substrate 152 and the second substrate 172 through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate 152 engaging a first side of the second substrate 172. The first substrate 152 engages the first roller 104, which has a higher temperature than the second roller 108, and the hydrophobic material penetrates the first substrate 104 and the second substrate 108 to bond the substrates together. |
