METHOD OF FABRICATING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR CHIP SUPPORTING CARRIER AND CHIP MOUNTING DEVICE

摘要

In fabricating semiconductor packages, a first supporting unit is supported by a supporting substrate with one surface of an adhesive sheet directed upward, the first supporting unit being constituted by attaching the adhesive sheet having an adhesive layer as the one surface thereof and a non-adhesive layer as the other surface thereof to a frame member; semiconductor chips are mounted on the one surface of the adhesive sheet; on the adhesive sheet, a resin portion containing the semiconductor chips is formed by resin-sealing the semiconductor chips; the first supporting unit is removed from the second supporting unit; the resin portion is stripped from the adhesive sheet; external connection members are formed at the semiconductor chips contained in the resin portion; and portions between the respective semiconductor chips contained in the resin portion are cut to obtain individual semiconductor packages.

主权项

1. A method of fabricating semiconductor packages, comprising:
a first supporting unit supporting step of supporting a first supporting unit by a supporting substrate constituting a second supporting unit in a state of directing one surface of an adhesive sheet upward, the first supporting unit being constituted by attaching the adhesive sheet having an adhesive layer as the one surface thereof and a non-adhesive layer as the other surface thereof to a frame member; a chip mounting step of mounting a plurality of semiconductor chips on the one surface of the adhesive sheet; a resin portion forming step of forming, on the adhesive sheet, a resin portion containing the plurality of semiconductor chips by resin-sealing the plurality of semiconductor chips; a first supporting unit removing step of removing the first supporting unit in which the resin portion is formed on the adhesive sheet, from the second supporting unit; a sheet stripping step of stripping the resin portion from the adhesive sheet; an external connection member forming step of forming external connection members at the plurality of semiconductor chips contained in the resin portion; and a semiconductor package obtaining step of cutting portions between the respective semiconductor chips contained in the resin portion to obtain individual semiconductor packages.