HEAT-CURABLE RESIN COMPOSITION, POLYAMIDE, ADHESIVE SHEET, CURED ARTICLE, AND PRINTED WIRING BOARD

摘要

Provided is a heat-curable resin composition which exhibits excellent dimensional stability during the curing of the resin composition and exhibits excellent adhesion properties, excellent heat resistance, excellent wet heat resistance, excellent electric insulation properties, excellent flexibility, a low electric constant and a low dielectric tangent after the curing of the resin composition. The heat-curable resin composition according to the present invention comprises: (A) a polyamide having a phenolic hydroxy group in a side chain thereof, which is produced by polymerizing a polybasic acid monomer with a polyamine monomer; and (B) a compound having tri-functionality or higher functionality, which can react with the phenolic hydroxy group. The polyamide (A)-constituting monomers to be used include a monomer having a phenolic hydroxy group and a monomer having a C20-60 hydrocarbon group (excluding an aromatic ring to which the phenolic hydroxy group can bond) and having a C5-10 cyclic structure.