CHIP ELECTRONIC COMPONENT

摘要

The present invention provides a chip electronic component which comprises: a main body of a magnetic material including a metal magnetic material powder; an inner coil unit embedded inside the main body of the magnetic material; and a plating smear prevention layer arranged on at least one from an upper surface and a lower surface of the main body of the magnetic material. The plating smear prevention layer comprises a magnetic powder, and the magnetic powder included in the plating smear prevention layer has D50 of 0.1 um to 3.5 um.