发明名称 |
POLISHING PAD AND POLISHING METHOD |
摘要 |
A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved with the even tracking zone.
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申请公布号 |
US2009104849(A1) |
申请公布日期 |
2009.04.23 |
申请号 |
US20070960451 |
申请日期 |
2007.12.19 |
申请人 |
IV TECHNOLOGIES CO., LTD. |
发明人 |
WANG YU-PIAO |
分类号 |
B24B29/00;B24B1/00 |
主分类号 |
B24B29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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