| 摘要 |
PROBLEM TO BE SOLVED: To suppress the reduction in optical coupling efficiency of laser light emitted from a semiconductor laser as much as possible as well as ensuring heat dissipation efficiency. SOLUTION: A Peltier element 19 is fixed on the top surface of a bottom plate 2 constituting a package and on the Peltier element 19, a semiconductor laser 11, a lens 13, an isolator 15, and a light-receiving element 16 are fixed via a substrate 18. The bottom plate 2 is surrounded by a sidewall 3 rising from its periphery and surrounding the periphery of the bottom plate 2. To a front wall 3a of the sidewall 3, in which an emit opening 9 is formed, an optical fiber 7 into which laser light emitted from the semiconductor laser 11 enters is connected. A recess part 2e is formed on the bottom surface of the bottom plate 2 and a heat dissipation sheet 5 is embedded in the recess part 2e of the bottom plate 2. COPYRIGHT: (C)2009,JPO&INPIT
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