LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A light emitting device, a light emitting package, and a method for manufacturing the light emitting device are provided to improve the luminous efficiency of the light emitting device by spreading a current flowing in a light emitting structure by forming a current spread layer. CONSTITUTION: A protection member(155) is formed around the upper side of a conductive support member(170). The conductive support member includes a rounded cavity(172). A reflection layer(159) is formed on the conductive support member. A light emitting structure(145) is formed on the reflection layer and the protection member. The light emitting structure includes a second conductive semiconductor layer(150), an active layer(140), and a first conductive semiconductor layer(130).