| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin molding for semiconductor light-emitting device which is less susceptible to discoloration and ensures high luminance by using a silicon resin and maintaining a high reflectance, and ensures high reliability when it is used for a long term because it is not peeled off easily from a sealing material or a lead frame. <P>SOLUTION: The resin molding for semiconductor light-emitting device is obtained from a silicon resin composition containing (A) polyorganosiloxane, (B) a white pigment, and (C) a hardening catalyst. When the resin molding is exposed to a vapor of abietic acid for 20 min at a distance of 3 cm above an abietic acid heated at 200°C and generating vapor of abietic acid, and then irradiated with UV having a wavelength of 250-500 nm or visible light (intensity: 1900 mW/cm<SP POS="POST">2</SP>(measured by a 365nm light-receiving element)) for 15 min, reduction rate of whiteness of the resin molding is 40% or less before and after irradiation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
