| 发明名称 | Liquid ejection head and process for producing liquid ejection head | ||
| 摘要 | A liquid ejection head including a recording element substrate provided with a substrate and a flow-path-forming member forming a flow path in a principal surface of the substrate, a support member supporting the recording element substrate and an underfill material covering at least a joint portion at which the substrate and the support member are joined to each other, wherein the flow-path-forming member is formed in such a manner that an end portion thereof projects from at least one side surface of the substrate, the underfill material covers an external surface of the joint portion and covers the at least one side surface of the substrate in such a manner that the underfill material reaches the projecting end portion of the flow-path-forming member. | ||
| 申请公布号 | US9211715(B2) | 申请公布日期 | 2015.12.15 |
| 申请号 | US201414479544 | 申请日期 | 2014.09.08 |
| 申请人 | Canon Kabushiki Kaisha | 发明人 | Ibe Satoshi;Nagata Shingo |
| 分类号 | B41J2/14;B41J2/16 | 主分类号 | B41J2/14 |
| 代理机构 | Fitzpatrick, Cella, Harper & Scinto | 代理人 | Fitzpatrick, Cella, Harper & Scinto |
| 主权项 | 1. A liquid ejection head comprising: a recording element substrate provided with a substrate and a flow-path-forming member forming a flow path in a principal surface of the substrate; a support member supporting the recording element substrate; and an underfill material covering at least a joint portion at which the substrate and the support member are joined to each other, wherein the recording element substrate is arranged in a depressed portion of the support member to form a space between a side surface of the recording element substrate and a side wall of the support member forming the depressed portion opposing the side surface, wherein the underfill material does not completely fill the space between a side surface of the recording element substrate and a side wall of the support member forming the depressed portion opposing the side surface, wherein the flow-path-forming member has an end portion which projects from at least one side surface of the substrate, and wherein the underfill material covers an external surface of the joint portion and covers the at least one side surface of the substrate in such a manner that the underfill material reaches the projecting end portion of the flow-path-forming member. | ||
| 地址 | Tokyo JP | ||