| 摘要 |
Provided is a circuit structure (11) having a heat radiation plate (25), an insulation sheet (30) layered on the heat radiation plate (25), and a circuit substrate (12) layered on the heat radiation plate (25) with the insulation sheet (30) disposed therebetween, wherein the circuit substrate (12) is fixed to the heat radiation plate (25) by being screwed, and between the insulation sheet (30) and the circuit substrate (12), a thermally conductive member (35) is disposed. |
